Basic Process Configuration
Main Equipment
| 주요 설비명 | 수량 | Maker |
|---|---|---|
| PCB Laser Marking | 1 | STS |
| Screen Printer | 3 | DEK,GKG |
| SPI(Screen Print Inspection) | 3 | PARMI |
| Chip Mounter | 3 | 한화 |
| Multi Mounter | 3 | 한화 |
| Reflow | 3 | Hella,TSM |
| AOI (Auto Optical Inspection) | 3 | SAKI,Pemtron |
| X-Ray Inspection | 1 | SEC |
| ICT | 2 | 테스탑 |
| Wave Solder | 3 | KSM.일본전열,신명기전 |
| Router (PCB Cutting) | 4 | IMPEC |
| Robot Solder | 2 | Japan Unix |
| Solder Dispensor | 1 | Musasi |
| Auto Coating | 1 | PVC |
| Function Tester | 30 | 자체제작,서연 |
Product Process Image
Product Process Layout 1’st Floor
Product Process Layout 2’nd Floor
