Basic Process Configuration
Main Equipment
주요 설비명 | 수량 | Maker |
---|---|---|
PCB Laser Marking | 1 | STS |
Screen Printer | 3 | DEK,GKG |
SPI(Screen Print Inspection) | 3 | PARMI |
Chip Mounter | 3 | 한화 |
Multi Mounter | 3 | 한화 |
Reflow | 3 | Hella,TSM |
AOI (Auto Optical Inspection) | 3 | SAKI,Pemtron |
X-Ray Inspection | 1 | SEC |
ICT | 2 | 테스탑 |
Wave Solder | 3 | KSM.일본전열,신명기전 |
Router (PCB Cutting) | 4 | IMPEC |
Robot Solder | 2 | Japan Unix |
Solder Dispensor | 1 | Musasi |
Auto Coating | 1 | PVC |
Function Tester | 30 | 자체제작,서연 |